IEC 60249-2-17:1992
(Main)Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
General Information
- Abstract
Gives requirements for the properties of this polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (copper foil not included) not greater than 0,8 mm (0,031 in). The contents of the corrigendum of June 1992 have been included in this copy.
- Status
- Replaced
- Publication Date
- 28-Feb-1992
- Technical Committee
- TC 91 - Electronics assembly technology
- Drafting Committee
- WG 1 - TC 91/WG 1
- Current Stage
- WPUB - Publication withdrawn
- Start Date
- 15-Oct-2004
- Completion Date
- 28-Aug-2026
Buy Documents
IEC 60249-2-17:1992/COR1:1992 - Corrigendum 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards Released:6/1/1992
Relations
- Effective Date
- 05-Sep-2023
- Effective Date
- 05-Sep-2023
Buy Documents
IEC 60249-2-17:1992/COR1:1992 - Corrigendum 1 - Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards Released:6/1/1992
Frequently Asked Questions
IEC 60249-2-17:1992 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards". This standard covers: Gives requirements for the properties of this polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (copper foil not included) not greater than 0,8 mm (0,031 in). The contents of the corrigendum of June 1992 have been included in this copy.
Gives requirements for the properties of this polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Laminated sheets covered by this specification have thicknesses (copper foil not included) not greater than 0,8 mm (0,031 in). The contents of the corrigendum of June 1992 have been included in this copy.
IEC 60249-2-17:1992 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60249-2-17:1992 has the following relationships with other standards: It is inter standard links to IEC 61249-2-11:2003, IEC 60249-2-17:1992/AMD3:2000. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 60249-2-17:1992 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
IEC Publication 249-2-17
Publication 249-2-17 de la CEI
(First edition - 1992)
(Première édition - 1992)
Base materials for printed circuits
Matériaux de base pour circuits imprimés
Part 2: Specifications
Partie 2: Spécifications
Specification No. 17: Thin polyimide woven glass
Spécification n° 17: Feuille de stratifié mince
fabric copper-clad laminated sheet of defined
en tissu de verre polyimide couverte de cuivre,
flammability for use in the fabrication of
d’inflammabilité définie, destinée à la fabrication
multilayer printed boards
des cartes imprimées multicouches
C O R R I G E N D U M 1
Page 10
Paragraphe 5, tableau 1
Au lieu de:
Résistivité transversale après chaleur 2.3 10 000 MΩ ⋅ min.
humide, mesure effectuée dans la
chambre climatique (facultatif)
Résistivité transversale après chaleur 2.3 50 000 MΩ ⋅ min.
humide et rep
...



