SIST EN IEC 60749-24:2026
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2025)
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2025)
IEC 60749-24:2025 specifies unbiased highly accelerated stress testing (HAST). HAST is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure that the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion).
This test is used to identify failure mechanisms internal to the package and is destructive.
This edition includes the following significant technical changes with respect to the previous edition:
a) rearrangement of clauses to reposition requirements;
b) addition of two notes to the post-test electrical procedures.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 24: Beschleunigte Feuchtigkeitsbeständigkeit - Unvoreingenommene Hast (IEC 60749-24:2025)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 24: Résistance à l'humidité accélérée - HAST sans polarisation (IEC 60749-24:2025)
L'IEC 60749-24:2025 spécifie un essai fortement accéléré de contrainte d’humidité (HAST, Highly Accelerated Stress Testing) sans polarisation. L’essai HAST est réalisé dans le but d’évaluer la fiabilité des dispositifs à l’état solide sous boîtiers non hermétiques dans des environnements humides. Il s’agit d’un essai fortement accéléré qui utilise une température et une humidité dans des conditions sans condensation, pour accélérer la pénétration d’humidité à travers le matériau de protection extérieur (agent d’enrobage ou de scellement) ou par l’interface entre le matériau de protection extérieur et les conducteurs métalliques qui le traversent. La polarisation n’est pas appliquée dans cet essai pour s’assurer que les mécanismes de défaillance potentiellement éclipsés par la polarisation puissent être découverts (la corrosion galvanique, par exemple).
Cet essai destructif est utilisé pour identifier les mécanismes de défaillance internes au boîtier.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) réorganisation des articles pour repositionner les exigences;
b) ajout de deux notes aux procédures électriques après l’essai.
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 24. del: Povečana odpornost proti vlagi (IEC 60749-24:2025)
Standard IEC 60749-24:2025 določa preskušanje z močno povečanim obremenjevanjem (HAST) brez prednapetosti, ki se uporablja za vrednotenje zanesljivosti nehermetično sklopljenih polprevodniških elementov v vlažnih okoljih. Gre za preskus z močno povečanim temperaturnim in vlažnostnim obremenjevanjem v pogojih brez kondenzacije, pri katerem se poveča prodiranje vlage skozi zunanji zaščitni material (enkapsulant ali tesnilo) ali vzdolž vmesnika med zunanjim zaščitnim materialom in kovinskimi vodniki, ki prehajajo skozenj. V tem preskusu se ne uporabljajo odstopanja, da je mogoče odkriti mehanizme odpovedi, ki bi lahko bili zaradi tega prezrti (npr. galvanska korozija). Ta preskus se uporablja za identifikacijo mehanizmov odpovedi v notranjosti sklopa in je porušitven. Ta izdaja v primerjavi s prejšnjo vključuje naslednje pomembne tehnične spremembe: a) preureditev točk z namenom spremembe zahtev; b) dodatek dveh opomb k električnim postopkom po preskusu.
General Information
- Status
- Published
- Public Enquiry End Date
- 28-Feb-2025
- Publication Date
- 04-Feb-2026
- Technical Committee
- I11 - Imaginarni 11
- Current Stage
- 6060 - National Implementation/Publication (Adopted Project)
- Start Date
- 20-Jan-2026
- Due Date
- 27-Mar-2026
- Completion Date
- 05-Feb-2026
Relations
- Effective Date
- 01-Mar-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
Overview
SIST EN IEC 60749-24:2026 defines requirements and methods for accelerated moisture resistance testing of semiconductor devices using the Unbiased Highly Accelerated Stress Test (HAST) technique. Unbiased HAST is a destructive reliability test designed for non-hermetically packaged solid-state devices subjected to humid environments. The standard is essential for identifying failure mechanisms-especially those not revealed when electrical bias is applied-such as galvanic corrosion.
This edition presents several updates over previous versions, including rearrangement of clauses to clarify requirements and new notes related to post-test electrical procedures. The document aligns with international practices, supporting consistent evaluation of device reliability in the electronics industry.
Key Topics
Purpose of Unbiased HAST
The test accelerates moisture penetration through encapsulant material or along interfaces with conductors, without applying electrical bias. This approach helps uncover hidden failure mechanisms and supports robust reliability analysis.Scope of Application
The method is aimed at non-hermetic semiconductor packages, such as plastic-encapsulated microcircuits, to simulate operational stresses under humid, non-condensing conditions.Destructive Nature
Unbiased HAST is inherently destructive, used primarily during product qualification, reliability assessment, or process validation.Test Apparatus and Procedures
- Requires a chamber that maintains specific temperature and humidity under pressure
- Use of distilled or deionized water for humidity generation
- Controlled sample placement to minimize temperature gradients and contamination
- Careful ramp-up and ramp-down to avoid condensation
Typical Test Conditions
- Elevated temperatures (e.g., 130°C or 110°C) and high relative humidity (85%)
- Defined testing durations (e.g., 96 hours or 264 hours, depending on conditions)
- Strict controls to avoid moisture condensation and maintain the integrity of test results
Failure Criteria
Devices are evaluated post-exposure; any deviation from parametric limits or loss of functionality under nominal and worst-case conditions is classified as a failure unless caused by external damage due to the test itself.
Applications
Product Qualification
Manufacturers use unbiased HAST to qualify new semiconductor products for use in humid environments, ensuring reliability before market release.Reliability Assessment
Reliability engineers employ this method for periodic process validation, root cause analysis, or comparison between materials and assembly techniques.Alternative to Autoclave Testing
The technique serves as an alternative or complement to traditional unbiased autoclave methods, often providing faster results at more aggressive stress levels.Regulatory and Supplier Compliance
Compliance with this standard supports procurement, supplier qualification, and adherence to regulatory requirements involving environmental stress testing.Identifying Latent Failures
The method is especially valuable for uncovering latent failure mechanisms like internal corrosion, delamination, or degradation that are not always apparent under electrical bias or less severe conditions.
Related Standards
IEC 60749-5:
Mechanical and climatic test methods - Steady-state temperature humidity bias life test.IEC 60749-33:
Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased autoclave.JEDEC JEP122H:
Provides guidance on failure mechanisms and models for semiconductor devices.JEDEC JESD22-A118B.01:
Basis for accelerated moisture resistance testing methods, including unbiased HAST.
Conclusion
Adopting SIST EN IEC 60749-24:2026 streamlines the evaluation of semiconductor device reliability in demanding environments. The standard offers clear protocols for accelerated moisture resistance testing, aiding manufacturers, suppliers, and quality assurance teams in maintaining robust performance standards for electronic components used worldwide.
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Frequently Asked Questions
SIST EN IEC 60749-24:2026 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2025)". This standard covers: IEC 60749-24:2025 specifies unbiased highly accelerated stress testing (HAST). HAST is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure that the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion). This test is used to identify failure mechanisms internal to the package and is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) rearrangement of clauses to reposition requirements; b) addition of two notes to the post-test electrical procedures.
IEC 60749-24:2025 specifies unbiased highly accelerated stress testing (HAST). HAST is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid environments. It is a highly accelerated test which employs temperature and humidity under non-condensing conditions to accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors which pass through it. Bias is not applied in this test to ensure that the failure mechanisms potentially overshadowed by bias can be uncovered (e.g. galvanic corrosion). This test is used to identify failure mechanisms internal to the package and is destructive. This edition includes the following significant technical changes with respect to the previous edition: a) rearrangement of clauses to reposition requirements; b) addition of two notes to the post-test electrical procedures.
SIST EN IEC 60749-24:2026 is classified under the following ICS (International Classification for Standards) categories: 19.020 - Test conditions and procedures in general; 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN IEC 60749-24:2026 has the following relationships with other standards: It is inter standard links to SIST EN 60749-24:2004, SIST EN IEC 60749-5:2024, SIST EN 60749-33:2004, SIST EN IEC 60749-30:2020. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
SIST EN IEC 60749-24:2026 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-marec-2026
Nadomešča:
SIST EN 60749-24:2004
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 24. del:
Povečana odpornost proti vlagi (IEC 60749-24:2025)
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated
moisture resistance - Unbiased HAST (IEC 60749-24:2025)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 24:
Beschleunigte Feuchtigkeitsbeständigkeit - Unvoreingenommene Hast (IEC 60749-
24:2025)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
24: Résistance à l'humidité accélérée - HAST sans polarisation (IEC 60749-24:2025)
Ta slovenski standard je istoveten z: EN IEC 60749-24:2026
ICS:
19.020 Preskuševalni pogoji in Test conditions and
postopki na splošno procedures in general
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60749-24
NORME EUROPÉENNE
EUROPÄISCHE NORM January 2026
ICS 31.080.01 Supersedes EN 60749-24:2004
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 24: Accelerated moisture resistance - Unbiased HAST
(IEC 60749-24:2025)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 24: Résistance à Prüfverfahren - Teil 24: Beschleunigte
l'humidité accélérée - HAST sans polarisation Feuchtigkeitsbeständigkeit - Unvoreingenommene Hast
(IEC 60749-24:2025) (IEC 60749-24:2025)
This European Standard was approved by CENELEC on 2026-01-01. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-24:2026 E
European foreword
The text of document 47/2957/FDIS, future edition 2 of IEC 60749-24, prepared by TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-24:2026.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2027-01-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2029-01-31
document have to be withdrawn
This document supersedes EN 60749-24:2004 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 60749-24:2025 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60749-5 - Semiconductor devices - Mechanical and EN IEC 60749-5 -
climatic test methods - Part 5: Steady-state
temperature humidity bias life test
IEC 60749-33 - Semiconductor devices - Mechanical and EN 60749-33 -
climatic test methods - Part 33:
Accelerated moisture resistance -
Unbiased autoclave
IEC 60749-24 ®
Edition 2.0 2025-11
INTERNATIONAL
STANDARD
Semiconductor devices - Mechanical and climatic test methods -
Part 24: Accelerated moisture resistance - Unbiased HAST
ICS 31.080.01 ISBN 978-2-8327-0862-0
IEC 60749-24:2025-11(en)
IEC 60749-24:2025 © IEC 2025
CONTENTS
FOREWORD . 2
1 Scope . 4
2 Normative references . 4
3 Terms and definitions . 4
4 Test requirements. 4
5 Test apparatus . 5
5.1 Test chamber . 5
5.2 Records . 5
5.3 Devices under stress . 5
5.4 Ionic contamination . 5
5.5 Distilled or deionized water . 5
6 Test conditions . 5
7 Procedure . 6
7.1 Mounting . 6
7.2 Ramp-up . 6
7.3 Ramp-down . 7
7.4 Test clock . 7
7.5 Electrical tests . 7
7.6 Handling . 7
8 Failure criteria . 7
9 Safety . 7
10 Summary . 8
Bibliography . 9
Table 1 – Test conditions for accelerated moisture resistance testing . 6
IEC 60749-24:2025 © IEC 2025
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Semiconductor devices - Mechanical and climatic test methods -
Part 24: Accelerated moisture resistance - Unbiased HAST
FOREWORD
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