EN ISO 9455-17:2024

SLOVENSKI STANDARD
01-marec-2024
Nadomešča:
SIST EN ISO 9455-17:2006
Talila za mehko spajkanje - Preskusne metode - 17. del: Preskus odpornosti
površine izolacije z glavnikom in preskus elektrokemičnega prenosa talila (ISO
9455-17:2024)
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test
and electrochemical migration test of flux residues (ISO 9455-17:2024)
Flussmittel zum Weichlöten - Prüfverfahren - Teil 17: Bestimmung des Widerstandes der
Oberflächenisolierung, Kammprüfung und elektrochemische Migrationsprüfung von
Flussmittelrückständen (ISO 9455-17:2024)
Flux de brasage tendre - Méthodes d'essai - Partie 17: Essai au peigne et essai de
migration électrochimique de résistance d'isolement de surface des résidus de flux (ISO
9455-17:2024)
Ta slovenski standard je istoveten z: EN ISO 9455-17:2024
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EN ISO 9455-17
EUROPEAN STANDARD
NORME EUROPÉENNE
January 2024
EUROPÄISCHE NORM
ICS 25.160.50 Supersedes EN ISO 9455-17:2006
English Version
Soft soldering fluxes - Test methods - Part 17: Surface
insulation resistance comb test and electrochemical
migration test of flux residues (ISO 9455-17:2024)
Flux de brasage tendre - Méthodes d'essai - Partie 17: Flussmittel zum Weichlöten - Prüfverfahren - Teil 17:
Essai au peigne et essai de migration électrochimique Bestimmung des Widerstandes der
de résistance d'isolement de surface des résidus de flux Oberflächenisolierung, Kammprüfung und
(ISO 9455-17:2024) elektrochemische Migrationsprüfung von
Flussmittelrückständen (ISO 9455-17:2024)
This European Standard was approved by CEN on 2 January 2024.

CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this
European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references
concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management
Centre has the same status as the official versions.

CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia,
Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway,
Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Türkiye and
United Kingdom.
EUROPEAN COMMITTEE FOR STANDARDIZATION
COMITÉ EUROPÉEN DE NORMALISATION

EUROPÄISCHES KOMITEE FÜR NORMUNG

CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CEN All rights of exploitation in any form and by any means reserved Ref. No. EN ISO 9455-17:2024 E
worldwide for CEN national Members.

Contents Page
European foreword . 3

European foreword
This document (EN ISO 9455-17:2024) has been prepared by Technical Committee ISO/TC 44 "Welding
and allied processes" in collaboration with Technical Committee CEN/TC 121 “Welding and allied
processes” the secretariat of which is held by DIN.
This European Standard shall be given the status of a national standard, either by publication of an
identical text or by endorsement, at the latest by July 2024, and conflicting national standards shall be
withdrawn at the latest by July 2024.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN shall not be held responsible for identifying any or all such patent rights.
This document supersedes EN ISO 9455-17:2006.
Any feedback and questions on this document should be directed to the users’ national standards
body/national committee. A complete listing of these bodies can be found on the CEN website.
According to the CEN-CENELEC Internal Regulations, the national standards organizations of the
following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland,
Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of
North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Türkiye and the
United Kingdom.
Endorsement notice
The text of ISO 9455-17:2024 has been approved by CEN as EN ISO 9455-17:2024 without any
modification.
International
Standard
ISO 9455-17
Second edition
Soft soldering fluxes — Test
2024-01
methods —
Part 17:
Surface insulation resistance comb
test and electrochemical migration
test of flux residues
Flux de brasage tendre — Méthodes d'essai —
Partie 17: Essai au peigne et essai de migration électrochimique
de résistance d'isolement de surface des résidus de flux
Reference number
ISO 9455-17:2024(en) © ISO 2024

ISO 9455-17:2024(en)
© ISO 2024
All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may
be reproduced or utilized otherwise in any form or by any means, electronic or mechanical, including photocopying, or posting on
the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below
or ISO’s member body in the country of the requester.
ISO copyright office
CP 401 • Ch. de Blandonnet 8
CH-1214 Vernier, Geneva
Phone: +41 22 749 01 11
Email: copyright@iso.org
Website: www.iso.org
Published in Switzerland
ii
ISO 9455-17:2024(en)
Contents Page
Foreword .iv
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 Principle . 1
5 Reagents . 2
6 Apparatus . 2
7 Inspection of test coupons . 8
7.1 Surface plating .8
7.1.1 Slivering (thin metal overhang on etch runs) .8
7.1.2 Plating nodules . .9
7.1.3 Plating pits .9
7.2 Surface laminate .9
8 Sample preparation . 9
8.1 Preparation of the flux test solution .9
8.1.1 Liquid flux samples .9
8.1.2 Solid flux samples .9
8.1.3 Flux-cored solder wire or preform samples .9
8.1.4 Solder paste samples .10
8.1.5 Paste flux samples.10
8.2 Preparation of the test coupons .10
8.2.1 Sample identification .10
8.2.2 Test coupons .10
8.2.3 Test coupon pre-cleaning .11
9 Procedure .11
9.1 Methods for connecting test coupons .11
9.1.1 Board circuitry layout .11
9.1.2 Preconditioning of SIR test coupons prior to processing (optional) . 13
9.2 Fluxing and soldering test patterns . 13
9.2.1 Liquid and solid flux samples and flux-cored solder wire samples . 13
9.2.2 Soldering using wave solder system . 13
9.2.3 Soldering using static solder pot . 13
9.2.4 Solder paste samples .14
9.2.5 Paste flux samples.14
9.3 Cleaning .14
9.4 SIR measurement . 15
9.4.1 High-resistance measurement system verification . 15
9.4.2 Test coupon measurements . 15
9.5 Electrochemical migration test . 15
10 Assessment . .16
11 Precision . 16
12 Test report .16
Annex A (informative) SIR testing guidance .18
Annex B (informative) Surface insulation resistance comb test and electrochemical migration
test of flux residues — Qualification test report .20
Bibliography .22

iii
ISO 9455-17:2024(en)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out through
ISO technical committees. Each member body interested in a subject for which a technical committee
has been established has the right to be represented on that committee. International organizations,
governmental and non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely
with the International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are described
in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the different types
of ISO documents should be noted. This document was drafted in accordance with the editorial rules of the
ISO/IEC Directives, Part 2 (see www.iso.org/directives).
ISO draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). ISO takes no position concerning the evidence, validity or applicability of any claimed patent
rights in respect thereof. As of the date of publication of this document, ISO had not received notice of (a)
patent(s) which may be required to implement this document. However, implementers are cautioned that
this may not represent the latest information, which may be obtained from the patent database available at
www.iso.org/patents. ISO shall not be held responsible for identifying any or all such patent rights.
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and expressions
related to conformity assessment, as well as information about ISO's adherence to the World Trade
Organization (WTO) principles in the Technical Barriers to Trade (TBT), see www.iso.org/iso/foreword.html.
This document was prepared by Technical Committee ISO/TC 44, Welding and allied processes, Subcommittee
SC 12, Soldering materials, in collaboration with the European Committee for Standardization (CEN)
Technical Committee CEN/TC 121, Welding and allied processes, in accordance with the Agreement on
technical cooperation between ISO and CEN (Vienna Agreement).
This second edition cancels and replaces the first edition (ISO 9455-17:2002), which has been technically
revised.
The main changes are as follows:
— in Clause 1 the applicability was clarified;
— in 6.5 the test coupon was aligned with IPC B53 from IEC 61189-5-501;
— in 9.5 the duration of the test was changed from 21 days to 1 000 h.
A list of all parts in the ISO 9455 series can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s
national standards body. A complete listing of these bodies can be found at
www.iso.org/members.html. Official interpretations of ISO/TC 44 documents, where they exist, are
available from this page: https://committee.iso.org/sites/tc44/home/interpretation.html.

iv
International Standard ISO 9455-17:2024(en)
Soft soldering fluxes — Test methods —
Part 17:
Surface insulation resistance comb test and electrochemical
migration test of flux residues
1 Scope
This document specifies a method of testing for deleterious effects that can arise from flux residues
after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in
ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste
constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as
agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the
soldering temperatures can be adjusted with agreement between tester and customer.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references,
the latest edition of the referenced document (including any amendments) applies.
ISO 5725-2, Accuracy (trueness and precision) of measurement methods and results — Part 2: Basic method for
the determination of repeatability and reproducibility of a standard measurement method
ISO 9454-1, Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and
packaging
IEC 61189-5-501, Test methods for electrical materials, printed boards and other interconnection structures
and assemblies — Part 5-501: General test methods for materials and assemblies — Surface insulation resistance
(SIR) testing of solder fluxes
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminology databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at https:// www .electropedia .org/
4 Principle
The objective of this test method is to characterize fluxes by determining the degradation of electrical
resistance and the electrochemical migration of rigid printed wiring coupon specimens after exposure to
the specified flux. This test is carried out at high humidity and heat conditions under bias voltage. For fluxes
which can leave undesirable residues and hence require cleaning, the results obtained from the test will
depend on the characteristics of the flux residue, substrate and metallization, and also on the effectiveness
of the cleaning operation.
ISO 9455-17:2024(en)
The measurement of surface insulation resistance (SIR) makes use of a printed wiring coupon substrate
having one or more conductive interleaved test patterns. Prior to being subjected to conditioning, the
interleaved test patterns are fluxed, soldered or tinned, and cleaned (when required). The patterns are then
exposed to a controlled environment for a specified time with an applied voltage. The surface insulation
resistance is measured using insulation test apparatus at a suitable test voltage while the test coupons are
in the controlled environment. Annex A provides further information on SIR testing.
5 Reagents
Use only reagents of recognized analytical grade or higher and only distilled or deionized water with a
conductivity of less than 0,05 µS/cm (resistivity ≥ 20 MΩ).
5.1 Propan‑2‑ol, (CH ) CHOH or other suitable solvent.
3 2
5.2 Cleaning solvent (if required), recommended by the flux manufacturer as suitable for the removal of
post-soldering flux residues or propan-2-ol.
6 Apparatus
Equipment shall be capable of demonstrating repeatability in accordance with the gauge r and R methodology
specified in ISO 5725-2. The usual laboratory apparatus and, in particular, the following shall be used.
6.1 Low profile container, for example a Petri dish or a watch glass.
6.2 Drying oven, suitable for use at up to 120 °C ± 3 °C.
6.3 Insulated wire or cable, 1 000 V general-purpose wire, temperature rated to 150 °C; primary
insulation of radiation-crosslinked; configuration suitable for equipment in use.
For consistent and repeatable results, it is important that all cabling carrying test signals be encased in an
electromagnetic shield. Most often, this is a metallic foil or braid material. Since SIR measurement often
deals with picoamperes of current or less, electromagnetic coupling (EMC) and other stray electrical fields
can unduly affect the test signals. Encasing the signal lines with a grounded metal dramatically reduces
currents due to EMC and other electrical noise. It is not necessary to individually shield each line, such as in
coaxial cabling, but separating voltage supply lines and current-return lines is recommended. A single EMC
shield can be used to encase all current-return lines.
6.4 Connector, 64-position, glass filled polyester body with the following properties:
— 1,27 mm × 10,67 mm (0,05 in × 0,42 in) on 2,54 mm (0,10 in) centres;
— 32 tabs, gold-plated over nickel plate over copper;
— 0,762 µm (0,000 03 in) gold plated post/pin mating end;
— bifurcated beam contacts;
— for coupon thickness of 1,40 mm to 1,78 mm (0,055 in to 0,070 in);
— capable of resisting temperatures up to 105 °C.
The IR (insulation resistance) of pin to pin at the connector shall have a resistance under climate and
temperature conditions, with a minimum of 1 012 Ω under test conditions. The connector shall be suitable
for use under different test conditions.
6.5 Test coupon. The test pattern IPC B53 according to IEC 61189-5-501, as shown in Figure 1, shall be
used for the test specimen. Of the six comb patterns, A and B patterns have 0,4 mm line width and 0,2 mm

ISO 9455-17:2024(en)
spacing, comprising 5 207 squares (IEC 61189-5-501); C and D patterns have 0,4 mm line width and 0,5 mm
spacing, comprising 1 038 squares (IPC B24); and E and F patterns have 0,318 mm line width and 0,318 mm
spacing, comprising 1 981 squares (Bellcore).
NOTE The Bellcore/Telcordia standard assumes a serial model for electronic parts and it addresses failure rates
[2,3]
at the infant mortality stage and at the steady-state stage with Methods I, II and III. Method I is similar to the MIL-
[6]
HDBK-217F parts count and part stress methods.
The specimen is approximately 150 mm × 95 mm in size. The conductive patterns shall be either unpreserved
bare copper or finished with electroless nickel gold (ENIG).
— 32 tabs, gold-plated over nickel plate over copper;
— 1,27 mm × 10,67 mm (0,05 in × 0,42 in) on 2,54 mm (0,10 in) centres.
The test pattern shall comply with Table 1 and the test coupon shall comply with Figure 1:
Table 1 — Test pattern
Type of SIR test patterns A and B C and D E and F
Width of conductor 0,4 mm 0,4 mm 0,318 mm
Spacing of conductor 0,2 mm 0,5 mm 0,318 mm
Overlap length 25,4 mm 15,25 mm 15,75 mm
Overlapping spaces 41 34 40
Squares (nominal) 5 207 1 038 1 981
NOTE Spaces are determined by counting the number of overlapping areas per pattern. Squares are determined by:
ln×
os
=q
w
s
where
l length of overlap
o
n number of spaces
s
q squares
w spacing width
s
ISO 9455-17:2024(en)
1)
Figure 1 — IPC B53‑Rev B test coupon
6.6 Soldering equipment.
6.6.1 Flux‑cored solder wire. If cabling is connected by soldering, non-activated flux of ISO 9454-1,
classification 1111, shall be used, tin/lead or lead-free solder shall be agreed between user and supplier
conforming to eutectic or near-eutectic tin/lead (S Sn60Pb40E or S Sn63Pb37) or lead-free solder
(Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier, see ISO 9453).
NOTE This wire consists of 60/40 or 63/37 tin/lead solder wire or Sn96,5Ag3Cu0,5 or other lead-free solder wire
agreed between user and supplier with a core of non-activated rosin (colophony) flux (ISO 9454-1, classification 1111).
6.6.2 Wave solder system, comprising a wave-soldering machine with the solder in a bath. Tin/lead or
lead-free solder shall be agreed between user and supplier and conform to eutectic tin/lead (Sn63Pb37)
or lead-free solder (Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier, see
ISO 9453). The set point temperature shall be maintained to ±5 °C.
1) Reproduced with permission from IEC 61189-5:2021 Copyright © 2021 IEC Geneva, Switzerland. www .iec .ch. IEC
has no responsibility for the placement and context (including other content or accuracy) in which the extracts are
reproduced, nor is IEC in any was responsible for the other content or accuracy therein.

ISO 9455-17:2024(en)
6.6.3 Static bath, containing solder to a depth of not less than 40 mm. Tin/lead or lead-free solder shall be
agreed between user and supplier and conform to grade Sn63Pb37E or Sn96,5Ag3Cu0,5 or other lead-free
solder agreed between user and supplier. The set point temperature shall be maintained to ±5 °C.
6.6.4 Reflow oven, with controllable temperature profiling.
6.6.5 Soldering iron.
6.7 Humidity chamber, capable of maintaining environments up to 90 °C with temperature control of
±2 °C and relative humidity (RH) up to 95 % with control of ±3 % at a specific RH set point when loaded with
test coupons. The chamber shall be constructed with stainless steel inner surfaces and be well insulated.
Some solid-state sensors cannot tolerate high temperature and humidity. The temperature and humidity
levels of the test chamber shall be recorded throughout the test, preferably with independent control
sensors.
If used, independent temperature and humidity sensors should be located in close proximity to the test
coupons. Conformance with these conditions will ensure that uniform test conditions can be maintained
while the chamber is under test load.
6.8 High‑resistance measurement system, capable of measuring surface insulation resistance (SIR) in
6 12
the range of at least 10 Ω to 10 Ω and with a test and bias voltage supply capable of providing a variable
voltage from 5 V to 100 V direct current (d.c.) (±2 %) with a 1 MΩ load. The sample selection system shall be
capable
...